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Despite the severe COVID-19 epidemic in Taiwan, the semiconductor packaging and testing plant Licheng (6239) has consolidated revenue of NT$6.886 billion since the end of May, a record high in a single month. The legal person pointed out that Licheng continued to benefit from strong memory packaging and testing orders and the growth of logic chip packaging and testing.

Licheng's consolidated revenue in May was 6.886 billion yuan, an increase of 3.22% from April's 6.671 billion yuan, an increase of 6.85% from 6.445 billion yuan in the same period last year, a record single month high; accumulated in the first five months of this year, Licheng self-integrated and merged Revenue was 31.987 billion yuan, a slight increase of 0.52% from 31.82 billion yuan in the same period last year.

Foreign legal persons pointed out that Licheng continued to benefit from strong dynamic random access memory (DRAM) packaging and testing orders in the second quarter. In addition, the visibility of NAND Flash packaging and testing orders can be seen in the third quarter.

In the logic chip packaging and testing, Licheng pointed out that bumping and wafer-level packaging (WLP) drive the product portfolio. It is estimated that the proportion of logic chips for bumping wafers will exceed 50% from the second quarter.

Looking ahead to capital expenditures, Licheng pointed out that the scale of capital expenditures in the first quarter of this year was approximately NT$2.6 billion. It is estimated that capital expenditures this year can maintain the level of previous years, approaching 15 billion yuan.

The legal person stated that Licheng will actively expand its fan-out wafer-level packaging (FOFLP) production capacity this year, and plans to transfer more than 50% of its wafer-level packaging production capacity to logic chip packaging and testing applications by the end of this year.


儘管台灣本土COVID-19疫情嚴峻，不過半導體封測廠力成 (6239) 自結5月合併營收新台幣68.86億元，創歷年單月新高。法人指出力成持續受惠記憶體封測訂單強勁和邏輯晶片封測成長。
力成自結5月合併營收68.86億元，較4月66.71億元成長3.22%，比去年同期64.45億元增加6.85%，創歷年單月新高；累計今年前5月力成自結合併營收319.87億元，較去年同期318.2億元微增0.52%。


外資法人指出，力成第2季持續受惠動態隨機存取記憶體（DRAM）封測訂單強勁，另外NAND型快閃記憶體（NAND Flash）封測訂單能見度可看到第3季。
在邏輯晶片封測，力成指出凸塊晶圓（Bumping）和晶圓級封裝（WLP）帶動產品組合，預估第2季起凸塊晶圓的邏輯晶片應用占比可超過50%。


展望資本支出，力成指出今年首季資本支出規模約新台幣26億元，預估今年資本支出可維持往年水準、接近150億元。
法人表示，力成今年積極擴充扇出型晶圓級封裝（FOFLP）產能，今年底前規劃將超過50%的晶圓級封裝產能轉移到邏輯晶片封測應用

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